MICRO SIM CARD 連接器
詳細介紹
NOTES:
MATERIAL:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:Copper Alloy
Shell:STAINLESS
PLATING:
Contact:Plated 30u" Ni Overall,Solder Area:Tin,Contact G/F
Shell:Plated 30u" Ni Overall
Plated G/F Selective Contact Area
Electrical:
Current Rating:0.5mA max.
Voltage Rating:50V DC MAX
Ambient Temperature Range:-20ºC ~ +85ºC
Storage Temperature Range:-40ºC ~ +70ºC
Ambient Humidity Range:95% R.H. Max.
Contact Resistance:100mΩ max.
Insulation Resistance:1000MΩ min./250V DC
Dielectric Withstanding Voltage:500V AC
Mating Cycles:5000 Insertions
Temperature:260ºC±5º