MICRO SIM CARD 連接器
詳細介紹
MATERIAL:
Insulator:High Temperature Thermoplastic,UL84V-0.
Contact:Copper Alloy
SHELL:SUS
PLATING:
Contact:Plated 50u" Ni Overall Contact Au 1U
Shell:Plated 50u" Ni Overall
Plated 1u" Au Selective Contact Area
ELECTRICAL:
Current Rating:0.5mA AC/DC max.
Voltage Rating:125V AC/DC
Ambient Temperature Range:-20ºC ~ +60ºC
Storage Temperature Range:-40ºC ~ +70ºC
Ambient Humidity Range:95% R.H. Max.
Contact Resistance:100m max.Ω
Insulation Resistance:1000M min./500V DC Ω
產品耐溫溫度:260
Mating Cycles:3000 Min Insertions