防水USB TYPE C 24P母座立式貼片SMT H=6.5mm 四腳DIP
SPECIFICATION:
1.ELECTRICAL:
1-1.CURRENT RATING:5A
1-2.CONTACT RESISTANCE:40mΩ Max
1-3.DIELECTRIC WITHSTANDING VOLTAGE:150V AC
1-4.INSULATION RESISTANCE:150V DC/100 MΩ MIN
2.MECHANICAL:
2-1.MATING FORCE:5~20N
2-2.UNMATING FORCE:8~20N
2-3.DURABILITY:10000 CYCLES;6~20N AFTER DURABILITY TEST
3.MATERIAL:
3-1.HOUSING&MOLDING:LCP UL94V-0
3-2.TERMINAL:C7025/C18400 T=0.12mm
3-3.SHELL:SUS304 T=0.30mm
3-4.MID PLATE:SUS304 T=0.15mm
4.PLATING SPECIFICATION:
4-1.TERMINAL:CONTACT POINT GOLD PLATED 1u" MIN PIN WELDING AREA GOLD PLATED 1u" MIN.
4-2.SHELL:PLATED Ni 60u" MIN
5.ELECTROPLATED PRODUCTS NEED TO UNDERGO TIN ADHESION TESTING:
THE TIN ADHESION AREA SHOULD REACH OVER 95%
6.SMT REFLOW SOLDERING (PEAK VALUE 260°C ± 5°C)SHALL BE FREE OF BLISTERING,
GLUE MELTING AND POOR COLOR CHANGE(DEFORMATION WITHIN TOLERANCE)
7.OPERATING TEMPERATURE:-40°C ~ +85°C
