USB 3.1 TYPE C 公頭16PIN立式貼片SMT H=10.95mm鉚合外殼

SPECIFICATION:
1.ELECTRICAL:
  1-1.CURRENT RATING:3A/5A
  1-2.CONTACT RESISTANCE:40Ω Max
  1-3.DIELECTRIC WITHSTANDING VOLTAGE:150V AC
  1-4.INSULATION RESISTANCE:150V DC/100 MΩ MIN
2.MECHANICAL:
  2-1.MATING FORCE:5~20N
  2-2.UNMATING FORCE:8~20N
  2-3.DURABILITY:10000 CYCLES;6~20N AFTER DURABILITY TEST
3.MATERIAL:
  3-1.HOUSING&MOLDING:LCP UL94V-0
  3-2.TERMINAL:C7025
  3-3.SHELL:SUS304
  3-4.MID PLATE:SUS301
4.PLATING SPECIFICATION:
  4-1.TERMINAL:CONTACT POINT GOLD PLATED 1u" MIN PIN WELDING AREA GOLD PLATED 1u" MIN
  4-2.SHELL:PLATED Ni 60u" MIN
5.ELECTROPLATED PRODUCTS NEED TO UNDERGO TIN ADHESION TESTING:
      THE TIN ADHESION AREA SHOULD REACH OVER 95%
6.SMT REFLOW SOLDERING(PEAK VALUE 260°C ± 5°C)SHALL BE FREE OF BLISTERING,
   GLUE MELTING AND POOR COLOR CHANGE (DEFORMATION WITH TOLERANCE)
7.OPERATING TEMPERATURE:-40°C ~ +85°C