MICRO HDMI 母座 19P 板上前插後貼雙排貼片 L=7.50mm
Notes:
1.Materials:
a.Housing:LCP+30% G/F,Black, UL94V-0;
b.Contact:Phosphor Copper(C5191),Gold Plating at mating area,
Matte Tin or Au Plating at solder tail,all over Nickel;
c.Shell:Phosphor Copper(C5191);
2.Ratings:
a.Current Rating:0.3A;
b.Operating Temperature:-40°C ~ 85°C;
3.Electrical Requirement:
a.LLCR:Excluding Conductor Resistance 10mΩ Max.(Target design value),
Contact:30mΩ Max.changed(Final),Shell:50mΩ Max.Changed(Final);
b.Dielectric Withstanding Voltage:150V AC (RMS) for 1 minute(Mated),
250V AC (RMS) for 1 minute(Unmated);
c.Insulation Resistance:10MΩ Min.@150V DC(Mated),100MΩ Min.@500V DC(Unmated);
4.Mechanical Performance:
a.Insertion force:44.1N (4.5Kgf) Max.;
b.Withdrawal force:4.9~25N(0.5~2.5Kgf);
c.Durability life:5000 Cycles;
5.IR Reflow:the peak temperature on board shall be maintained for 10 seconds at 260±5°c.
